EDN

X-FAB Rolls Out Trench-Isolated SOI CMOS Process

To reduce die size by up to 40 percent, Erfurt, Germany-based analog/mixed-signal foundry X-FAB Semiconductor Foundries AG Tuesday announced XT06, its 0.6-micrometer silicon-on-insulator (SOI) CMOS ...
EDN

X-Fab Debuts 0.6-Micron CMOS Process

X-Fab Semiconductor Foundries AG is now offering its 0.6-micron CMOS process for high-voltage applications such as embedded non-volatile memory. The mixed-signal technology, for applications up to 40V ...
Semiconductor Engineering

Process Variation Analysis Of Device Performance Using Virtual Fabrication — Methodology ...

A new methodology to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. August 18th, 2021 - By: Coventor A new methodology ...
Electronic Design

X-FAB Brings First CMOS Fab To Brazil

The Brazilian government and X-FAB Silicon Foundries have signed an agreement to bring semiconductor manufacturing to Brazil. Brazil's government-backed Excellence Center for Advanced Electronic ...