Infineon Technologies AG today announced the availability of its "Coil on Module" (CoM) package technology for official documents. The technology simplifies and improves manufacturing of electronic ...

Infineon, a manufacturer of semiconductor solutions for payment applications, introduced its Coil on Module chip package to support global distribution of dual interface bank and credit cards. The new ...

Infineon is expanding its CoM (Coil on Module) portfolio for secure contactless ID documents. The new SLC52 security chip is now available, integrated with the card antenna into a polycarbonate ...

In spring 2025, Global Studies opened COIL with the course Building a Sustainable World, where Katies collaborated with students from the Universidad Tecnológico de Monterrey in Mexico. Students in ...