System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Rib parts (top) trialed using spring-frame molding (shown here, bottom, with curved C-channel part) and double diaphragm forming (DDF) processes in the DARPA-funded and Boeing co-funded RAPM program ...

The hybrid-composite rear load floor uses unidirectional (UD) thermoplastic tapes plus direct-long-fiber thermoplastic (D-LFT) composites. Thermoplastic tapes provided high stiffness/strength in a ...

2008 - PACE Award Winner Webasto AG What: Low Pressure Injection-Compression Process for Panoramic Polycarbonate Roof Module Judge's Citation: OEMs are increasingly eager to substitute polycarbonate ...