Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the ...

Designing energy-efficient systems that meet the high bandwidth demands of high-performance computing (HPC) involves key trends in silicon technology: increasing transistor density, enhancing memory ...

The MarketWatch News Department was not involved in the creation of this content. BOSTON, July 24, 2024 /PRNewswire/ -- Over the past decade, the capacity of data center Ethernet switches has surged ...

Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Benchmark of ...