Enterprise AI teams are moving beyond single-turn assistants and into systems expected to remember preferences, preserve ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

Results such as these highlight the growing pains AI is experiencing as the technology becomes ingrained into enterprise operations. As questions swirl around issues such as security, memory, cost and ...

With the goal of increasing system performance per watt, the semiconductor industry is always seeking innovative solutions that go beyond the usual approaches of increasing memory capacity and data ...

Walk into any modern AI lab, data center, or autonomous vehicle development environment, and you’ll hear engineers talk endlessly about FLOPS, TOPS, sparsity, quantization, and model scaling laws.