The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

CHANDLER, Ariz., Feb. 03, 2026 (GLOBE NEWSWIRE) -- The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability and scalability. Integrated ...

Enables automotive OEMs and power converter designers to accelerate the time to market for discrete devices and power modules SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: ...

The University of Arkansas has received a $3.5 million grant to upgrade its High-Density Electronics Center and become a Power Packaging ...

As efforts to protect the environment have advanced, the use of inverters in industrial applications and green energy systems have continued to grow rapidly as a way to achieve low-power motor control ...

(Image courtesy of Elsevier Publishing). Who else would you want to author a book about the IGBT (insulated gate bipolar transistor) than its inventor, Dr. B. Jayant Baliga? This invention is widely ...

You’re undoubtedly familiar with power-switching devices such as the venerable and still very viable insulated-gate bipolar transistor (IGBT). An enhanced variation is the B-TRAN bipolar junction ...

The MSK3004 is an H-bridge MOSFET power module available in a space efficient isolated ceramic tab power SIP package. This device contains P-channel MOSFETS for the top transistors and N-channel ...