Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

The University of Arkansas has received a $3.5 million grant to upgrade its High-Density Electronics Center and become a Power Packaging ...

AUBURN HILLS, Mich., April 29, 2025 /PRNewswire/ -- BorgWarner is set to showcase its latest technology at the 46th Vienna Motor Symposium from May 14-16, 2025, at the Hofburg in Vienna and will lead ...

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...

With an increasing PV module market demand coming from old rooftops, curved rooftops, lightweight rooftops, outdoor activities and even moving vehicles, lightweight PV modules have a broader ...

The 1200V / 300A Half-Bridge IGBT is rated for 450A continuous DC current (Tj=90°C) based on Trench Gate Field Stop (TG-FS) technology. And it is housed in the CPAK-EDC package with a copper baseplate ...