Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

While dynamic modeling is arguably one of the most important technological developments for engineers in the last 50 years, many process control engineers are unable to use it. It requires proper time ...

Just over a decade ago, an article titled, "Advanced Control Strategies Move into the Field" (Control, October 2008), highlighted three evolving trends in the process control world that would "make ...

Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What ...