Thanks to advances in circuit miniaturization and systemin- package (SiP) technology, the goals of smaller size and more functionality have become attainable. Thanks to advances in circuit ...

Parts 1 and 2 of this three-part series reviewed the basics and SiP package technology and detailed the design challenges specific to RF SiPs. In this final installment, the author outlines the steps ...

RF SiP technology is an enabling packaging platform for wireless communication, which is constrained by the fact that, today, SiP design is an “expert engineering” process—one that is not scalable as ...