SAN JOSE, Calif.--(BUSINESS WIRE)--Today at Memcon 2024, Samsung Electronics, a world leader in advanced semiconductor technology, unveiled the expansion of its Compute Express Link (CXL) memory ...

A photo shared via Chinese social media, attributed to a Lenovo product manager, appears to show a Samsung LPCAMM2 memory module labeled 96 GB with an LPDDR5X-9600 data rate.

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

The company announced it has begun mass production of its new HBM4 memory modules.

The LPCAMM2 design is part of an ongoing effort to replace soldered LPDDR in mobile and ultra-thin systems with memory that is both upgradeable and space-efficient.

Samsung’s 96GB 9600 MT/s LPCAMM2 module was spotted in a Lenovo post, signaling higher-capacity, high-speed memory for future laptops.

TL;DR: Samsung will showcase its 42.5Gbps GDDR7 memory at ISSCC in February 2025, this ultra-fast GDDR7 memory offers significant bandwidth improvements over current models, with potential use in high ...

Memory chips are massive deal breakers for PCs, and Samsung is dropping bombs that will improve the industry more, centered on its DDR5 developments. It was reported that there is an upgrade coming, ...

Unsurprisingly for memory in 2026, you can't buy it yet.

Samsung has announced it has completed developing the world's first GDDR7 memory module for high-performance computing (HPC). This paves the way for its adoption by both AMD and Nvidia in future GPUs, ...

TL;DR: NVIDIA is negotiating with Samsung, SK hynix, and Micron to use SOCAMM memory modules in its Project DIGITS follow-up. SOCAMM offers better energy efficiency and more I/O channels than current ...

“[A]fter Samsung repeatedly failed its obligations to fulfill Netlist orders of memory products at competitive prices, Netlist terminated the [joint development agreement].” This Monday, Irvine, ...