Application Note: Packaging Implementation and Solder Reflow R Guidelines for Pb-Free Packages XAPP427 (v2.0) September 16, 2004 Summar y Recent legislative directives and corporate driven initiatives ...

This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/ Pb and Pb Free soldering. This allows assemblers to build on their extensive ...

Discrete electronic components such as resistors, capacitors and even larger IC's are shrinking down smaller every year, and that makes it harder for the average home maker or hobbyist to create their ...

Advancements in design processes are said to be responsible for the 236 series terminal blocks' ability to adapt to the solder reflow process. In particular, the series employs an optimized pin length ...

The SMT-8120 soldering-sintering paste, adapted from traditional MLCC paste, provides long-term reliability comparable to established TLPS pastes used in capacitor assembly. The sintered copper also ...