Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...

Powered by Infineon FX20 and Onsemi HyperLux AR2020, Vajra-2020MRS streams uncompressed 20 MP over USB-C, delivering low-latency 5K-class imaging on native UVC ...