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Abstract: Increasing demand for DRAM scaling and high-bandwidth has driven DRAM technology to 3D/2.5D integration. With the innovative Hybrid Bonding technology, a new Stacked Embedded DRAM (SEDRAM) ...

Abstract: In this paper, we present for the first time the realization of a 77 GHz chip-to-rectangular waveguide transition realized in an embedded Wafer Level Ball Grid Array (eWLB) package. The chip ...

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