Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

Abstract: This article presents an advanced bond wire interconnect solution to enable heterogeneous system designs from dc up to and exceeding 210 GHz. A wideband transition is realized by tailoring ...

Visual charts help patterns and trends stand out faster than raw numbers alone. Different visualization types suit different data goals and levels of detail. Clear visuals improve understanding across ...

Budgam district in Jammu and Kashmir — known for its natural beauty, meadows, and the Battle of Budgam — is home to IIT Guwahati student Toiyeb Ashiq. While the region is better known for producing ...